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US 8,076,744 B2Granted
Photosensitizing chip package and manufacturing method thereof
OwnerChien-Hung Liuinventor
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Abstract
A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrate provided with weir and covered up over the color attachment array; a proper gap being defined between the glass substrate and the color attachment array to promote permeability of stream of light by direct receiving stream of light from those photosensitizing chips constructed over the wafer.
Claims39
A photosensitizing chip package, comprising:
- a substrate having a first surface and a second surface;
- a photosensitizing chip disposed overlying the first surface of the substrate, wherein the photosensitizing chip has a top surface not facing towards the first surface of the substrate, and wherein the top surface of the photosensitizing chip is higher than uppermost plane of the first surface of the substrate;
- a bonding layer disposed between the photosensitizing chip and the first surface of the substrate;
- a transparent substrate disposed overlying the photosensitizing chip and the first surface of the substrate;
- a soldering point formed overlying the second surface of the substrate;
- and
- a conducting layer electrically connecting the soldering point and the photosensitizing chip, wherein there is no metal layer between the transparent substrate and the photosensitizing chip.
4 more elements
A photosensitizing chip package, comprising:
- a substrate having a first surface and a second surface;
- a photosensitizing chip disposed overlying the first surface of the substrate, wherein the photosensitizing chip has a top surface not facing towards the first surface of the substrate, and wherein the top surface of the photosensitizing chip is higher than uppermost plane of the first surface of the substrate;
- a color attachment array disposed over the photosensitizing chip;
- a bonding layer disposed between the photosensitizing chip and the first surface of the substrate;
- a transparent substrate disposed overlying the photosensitizing chip and the first surface of the substrate;
- a soldering point formed overlying the second surface of the substrate;
- and
- a conducting layer electrically connecting the soldering point and the photosensitizing chip, wherein there is no metal layer formed on at least an area of the color attachment array between the transparent substrate and the photosensitizing chip.
5 more elements
Dependencies are inferred from the claim text.