Waferless recipe optimization

A method for optimizing a metrology tool for measuring one or more characteristics of a semiconductor target, comprising:

• (a) providing a set of specifications and an initial input data for a particular target, wherein the specifications provide limits for characteristics of images that are to be measured by the metrology tool;
• and
• (b) automatically optimizing of the metrology tool for measuring the particular target so as to meet one or more of the provided specifications without further significant human intervention with respect to the metrology tool,
• wherein automatically optimizing the metrology tool includes adjusting one or more parameters that are selected from the following:
• a sizing and placement of region of interest that defines an image area to be analyzed, a sizing and placement of a target area from which an image is to be obtained, a dual aperture device (DAD) position, or one or more camera or detector parameters,
• wherein the metrology tool is an optical metrology tool,
• wherein automatically optimizing the metrology tool includes adjusting one or more parameters that are further selected from a focus or one or more algorithms to apply to the optical tool's settings, and wherein the specifications include a precision limit and the step of automatically optimizing the metrology tool includes adjusting the focus, SG/DG setting, and a filter setting until the precision limit is met.

An apparatus for analyzing one or more characteristics of a semiconductor target, comprising:

• an illumination source and illumination lens system for directing an incident beam towards a target;
• a output lens system for directing an output beam emanating from the target in response to the incident beam;
• a camera or detector for generating an image from the output beam;
• and
• a processor configured for:
• (a) providing a set of specifications, including a precision limit, and an initial input data for a particular target, wherein the specifications provide limits for characteristics of images that are to be measured by the apparatus further including a TIS (tool induced shift) value limit;
• and
• (b) automatically optimizing one or more settings of the apparatus for measuring the particular target so as to meet one or more of the provided specifications without further significant human intervention with respect to the apparatus:
• wherein automatically optimizing the apparatus includes adjusting a focus, SG/DG setting, and a filter setting until the precision limit is met and adjusting one or more parameters that are selected from the following:
• one or more algorithms to apply to the apparatus' settings, a sizing and placement of region of interest that defines an image area to be analyzed, a sizing and placement of a target area from which an image is to be obtained, a dual aperture device (DAD) position so as to meet the TIS value limit, or one or more camera or detector parameters.