Semiconductor device

A semiconductor device comprising:

• a first assembly including:
• a first semiconductor chip,
• a high-voltage bus bar that is bonded to one surface of the first semiconductor chip and that has a high-voltage terminal,
• a first metal wiring board that is connected to another surface of the first semiconductor chip using a bonding wire, and
• a third metal wiring board that is linked to the first metal wiring board, is separated by a prescribed interval from the bonding wire connected to the other surface of the first semiconductor chip, and is positioned parallel to the high-voltage bus bar;
• a second assembly including:
• a second semiconductor chip,
• a low-voltage bus bar that is connected to one surface of the second semiconductor chip using a bonding wire and that has a low-voltage terminal,
• a second metal wiring board that is bonded to another surface of the second semiconductor chip, and
• a fourth metal wiring board that is linked by being bent from an end portion of the second metal wiring board, is separated by a prescribed interval from the bonding wire connected to the second semiconductor chip, and is positioned parallel to the second metal wiring board;
• and
• an output bus bar having an output terminal extending from each end portion of the third metal wiring board and of the fourth metal wiring board,
• wherein the first assembly and the second assembly are positioned in separated, layered structures, and the output bus bar is positioned between the layered structures.