Semiconductor device including fuse

#This application claims the benefit of Korean Patent Application No. 10-2009-0008850, filed on Feb. 4, 2009, the disclosure of which is hereby incorporated by reference herein in its entirety.

#(i) Technical Field

#The present disclosure relates to a semiconductor device, and more particularly, to a semiconductor device including a fuse.

#Exemplary embodiments of the present invention can be more understood from the following detailed description taken in conjunction with the accompanying drawings in which:

#FIG. 1 is an arrangement plan view that schematically illustrates main elements of a semiconductor device according to an exemplary embodiment of the present invention;

#FIG. 2 is a cross-sectional view of a semiconductor device including one or more fuses, according to an exemplary embodiment of the present invention;

#Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. However, exemplary embodiments are not limited to the embodiments illustrated hereinafter, and the embodiments herein are rather introduced to provide easy and complete understanding of the scope and spirit of exemplary embodiments. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

#It will be understood that when an element, such as a layer, a region, or a substrate, is referred to as being “on,” “connected to” or “coupled to” another element, it may be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. Like reference numerals refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

#It will be understood that, although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of exemplary embodiments.