Method and apparatus for chip cooling
AssigneeInternational Business Machines Corporation
InventorsYves C. Martin, Lubomyr T. Romankiw, Theodore G. Van Kessel
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Abstract
In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of a system for cooling a heat-generating device, such as a semiconductor chip, includes a vaporization chamber for at least partially vaporizing a stream of liquid in a stream of a gas to produce a mixture of gas, vapor and liquid and a heat sink coupled to the vaporization chamber for transferring heat from the heat-generating device to the mixture.
Claims18
A system for cooling a heat-generating device, comprising:
- a vaporizer for at least partially vaporizing a stream of liquid in a presence of a stream of gas to produce a mixture of gas, vapor, and liquid;
- a heat sink adapted to be thermally coupled to the heat-generating device for transferring heat from the heat-generating device;
- and
- a chamber partially enclosing the heat sink and coupled to the vaporizer,
- wherein the vaporizer is external to the chamber and delivers the mixture of gas, vapor, and liquid to the heat sink to absorb the heat from the heat sink, and wherein the chamber has lateral dimensions that closely match comparable dimensions of the heat sink.
A method for cooling a heat-generating device, the method comprising:
- vaporizing at least partially a stream of liquid in a presence of a stream of gas using a vaporizer to produce a mixture having components of gas, vapor, and liquid;
- transferring heat from the heat-generating device to a heat sink that is thermally coupled to the heat-generating device, the heat sink being partially enclosed within a chamber that is coupled to the vaporizer;
- and
- delivering the mixture via the vaporizer to the heat sink so that the mixture absorbs the heat from the heat sink,
- wherein the chamber has lateral dimensions that closely match comparable dimensions of the heat sink.
Dependencies are inferred from the claim text.