Heat sink including extended surfaces

A device for improving the performance of an information handling system, the device comprising:

• an electronic component associated with the information handling system, the electronic component producing heat while in operation;
• a mass providing a heat sink to the electronic component;
• a set of extended surfaces for transferring heat from the mass;
• the set of extended surfaces defining a primary flow direction for a cooling fluid;
• a first subset of the set of extended surfaces having a first length measured in the primary flow direction;
• a second subset of the set of extended surfaces having a second length measured in the primary flow direction;
• each of the first and second subsets of extended surfaces including one or more extended surfaces;
• and
• the second subset of extended surfaces disposed closer to the hotspot of the electronic component than any other subset of the set of extended surfaces;
• wherein the second length is less than the first length such that a flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces.

An information handling system comprising:

• a processor;
• a memory communicatively coupled to the processor;
• a mass providing a heat sink to the processor;
• a set of extended surfaces for transferring heat from the mass;
• the set of extended surfaces defining a primary flow direction for a cooling fluid;
• a first subset of the set of extended surfaces having a first length measured in the primary flow direction;
• a second subset of the set of extended surfaces having a second length measured in the primary flow direction;
• each of the first and second subsets of extended surfaces including one or more extended surfaces;
• and
• the second subset of extended surfaces disposed closer to the hotspot of the electronic component than any other subset of the set of extended surfaces;
• wherein the second length is less than the first length such that a flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces.