Apparatus and method for thin die detachment
AssigneeASM Assembly Automation Ltd.
InventorsYiu Ming Cheung, Chi Ming Chong, Tat Wing Lee, Ka Lok Leung
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Abstract
The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.
Claims8
An apparatus for detachment of a thin die from a film, the film having a adhesive surface an which a plurality of dice are mounted, the apparatus comprising:
- an ejector device comprising a plurality of ejector pins,
- the ejector pins being operative to initiate detachment of a die from the film by contacting the film under the die on a second surface of the film opposite the adhesive surface
- substantially at the corners of the die within a predetermined distance from the edges of
- said die and by raising the film under the corners of the die;
- and
- a collet operative to detach the die from the film after detachment has been initiated by the ejector device, and to hold the die after detachment from the film;
- wherein the predetermined distance is less than 1.2 mm from the edges of the die where the die is a silicon die of between 3 mm to 8 mm in width and less than 0.15 mm thickness, the film has a thickness of approximately 0.1 mm and an interfacial adhesive strength between the die and the adhesive surface is less than 15 Joules per meter square.
An apparatus for detachment of a thin die from a film, the film having a adhesive surface on which a plurality of dice are mounted, the apparatus comprising:
- an ejector device comprising a plurality of ejector pins,
- the ejector pins being operative to initiate detachment of a die from the film by contacting the film under the die on a second surface of the film opposite the adhesive surface
- substantially at the corners of the die within a predetermined distance from the edges of said die and by raising the film under the corners of the die;
- and
- a collet operative to detach the die from the film after detachment has been initiated by the ejector device, and to hold the die after detachment from the film;
- wherein the predetermined distance is less than 1.6 mm from the edges of the die where the die is a silicon die of greater than 8 mm in width and less that 0.15 mm thickness, the film has a thickness of approximately 0.1 mm and an interfacial adhesive strength between the die and the adhesive surface is less than 15 Joules per meter square.
An apparatus for detachment of a thin die from a film, the film having a adhesive surface on which a plurality of dice are mounted, the apparatus comprising;
- an ejector device comprising a plurality of ejector pins,
- the ejector pins being operative to initiate detachment of a die from the film by contacting the film under the die on a second surface of the film opposite the adhesive surface
- substantially at the corners of the die within a predetermined distance from the edges of
- said die and by raising the film under the corners of the die;
- and
- a collet operative to detach the die from the film after detachment has been initiated by the ejector device, and to hold the die after detachment from the film;
- wherein the predetermined distance is less than 0.5 mm from the edges of the die where the die is a gallium arsenide die of between 3 mm to 8 mm in width and less than 0.15 mm thickness, the film has a thickness of approximately 0.1 mm and an interfacial adhesive strength between the die and the adhesive surface is less than 15 Joules per meter square.
An apparatus for detachment of a thin die from a film, the film having a adhesive surface on which a plurality of dice are mounted, the apparatus comprising:
- an ejector device comprising a plurality of ejector pins,
- the ejector pins being operative to initiate detachment of a die from the film by contacting the film under the die on a second surface of the film opposite the adhesive surface
- substantially at the corners of the die within a predetermined distance from the edges of
- said die and by raising the film under the corners of the die;
- and
- a collet operative to detach the die from the film after detachment has been initiated by the ejector device, and to hold the die after detachment from the film;
- wherein the ejector device comprises at least four ejector pins, each ejector pin corresponding to a position substantially at a corner of the die, and one or more ejector pins corresponding to a position substantially at a center portion of the die.
Dependencies are inferred from the claim text.