Apparatus for processing a substrate
AssigneeKabushiki Kaisha Toshiba
InventorsHideaki Sakurai, Masamitsu Itoh
Life of this patent
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AssigneeKabushiki Kaisha Toshiba
InventorsHideaki Sakurai, Masamitsu Itoh
Estimating the term…
A method for a substrate processing apparatus having a substrate holding mechanism and a chemical solution dispensing/sucking mechanism including a chemical solution dispensing port for supplying a first chemical solution and a chemical solution suction port, includes placing the target substrate on the substrate holding mechanism, laying out an auxiliary plate at a periphery of the substrate such that the two main faces are substantially flush with each other, supplying a second chemical solution onto the main faces, dispensing the first solution from the dispensing port and sucking the first and second solutions through the suction port, with the dispensing and suction ports brought into contact with the second solution, and while dispensing the first solution from the dispensing port and sucking the first solution through the suction port, scanning the dispensing/sucking mechanism such that the dispensing and suction ports are opposed to the main face of the substrate.
An apparatus for processing a substrate comprising:
Dependencies are inferred from the claim text.