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US 8,013,440 B2Granted
Enhanced thermal dissipation ball grid array package
AssigneeConexant Systems, Inc.
InventorRobert W Warren
Life of this patent
Estimating the term…
Abstract
In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active functional die and a thermal adhesive is used to bond an internal heat spreader to the dummy die. This provides a direct and relatively low thermal conductivity path from the heat source, i.e., the functional device to the top of the package, that is, the internal metal heat spreader which is also exposed to the air.
Claims17
A semiconductor package comprising:
- a semiconductor die having a fabricated pattern and bond pads;
- a heat spreader;
- a dummy semiconductor die in physical contact with the semiconductor die;
- and
- a thermal adhesive between the dummy semiconductor die and the heat spreader;
- wherein the thermal adhesive adheres the dummy semiconductor die and the heat spreader and conducts heat from the semiconductor die to the heat spreader.
3 more elements
A semiconductor package comprising:
- a fabricated semiconductor die having a fabricated pattern and bond pads;
- a dummy semiconductor die placed on top of the fabricated semiconductor die and being in physical contact there with;
- a heat spreader placed on top of the dummy semiconductor die;
- and
- a first thermal adhesive between the dummy semiconductor die and the heat spreader;
- wherein the first thermal adhesive adheres the dummy semiconductor die and the heat spreader and conducts heat from the dummy semiconductor die to the heat spreader and wherein the dummy semiconductor die conducts heat from the fabricated semiconductor die.
3 more elements
Dependencies are inferred from the claim text.