Semiconductor device
AssigneeRenesas Electronics Corporation
InventorAtsuki Ono
Life of this patent
Estimating the term…
Abstract
A semiconductor device has an electrical fuse formed on a substrate, having a first interconnect, a second interconnect respectively formed in different layers, and a via provided in a layer between the first interconnect and the second interconnect, connected to one end of the second interconnect and connected also to the first interconnect; and a guard interconnect portion formed in the same layer with the second interconnect, so as to surround such one end of the second interconnect, wherein, in a plan view, the second interconnect is formed so as to extend from the other end towards such one end, and the guard interconnect portion is formed so as to surround such one end of the second interconnect in three directions, while placing such one end at the center thereof.
Claims21
A semiconductor device, comprising:
- a substrate;
- an electrical fuse formed on said substrate, having a first interconnect and a second interconnect, respectively formed in different layers, and a via provided in a layer between said first interconnect and said second interconnect, the via being connected to one end of said second interconnect and connected also to said first interconnect;
- and
- a guard interconnect portion formed in the same layer with said second interconnect, so as to surround said one end of said second interconnect,
- wherein, in a plan view, said second interconnect is formed so as to extend from the other end towards said one end, and said guard interconnect portion is formed so as to surround said one end of said second interconnect in three directions, while placing said one end at the center thereof, and
- wherein a site of disconnection is formed in said via when said electrical fuse is blown.
A semiconductor device, comprising:
- a substrate;
- an electrical fuse formed on said substrate, having a first interconnect and a second interconnect, respectively formed in different layers, and a via provided in a layer between said first interconnect and said second interconnect, the via being connected to one end of said second interconnect and connected also to said first interconnect;
- a guard interconnect portion formed in the same layer with said second interconnect, so as to surround said one end of said second interconnect;
- a first terminal connected to one end of said first interconnect, said end being opposite to said other end connected to said via;
- and
- a second terminal connected to one end of said second interconnect, said end being opposite to said other end connected to said via,
- wherein said first interconnect has a width narrower than that of said first terminal, and said second interconnect has a width narrower than that of said second terminal, and
- wherein, in a plan view, said second interconnect is formed so as to extend from the other end towards said one end, and said guard interconnect portion is formed so as to surround said one end of said second interconnect in three directions, while placing said one end at the center thereof.
Dependencies are inferred from the claim text.