Folded lead-frame packages for MEMS devices

A MEMS package comprising:

• a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery, wherein said first and second pre-molded lead-frame substrates are interconnected with metal leads;
• and
• at least one MEMS device attached to one of said substrates wherein said substrate has a through-hole therein extending through said substrate wherein an external signal can enter through said through-hole and reach said at least one MEMS device and wherein said first pre-molded lead-frame substrate is folded over and joined to said second pre-molded lead-frame substrate to house said at least one MEMS device.

A MEMS package comprising:

• a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery, wherein said first and second pre-molded lead-frame substrates are interconnected with metal leads;
• and
• at least one MEMS device attached to one of said substrates wherein said first pre-molded lead-frame substrate is folded over and joined to said second pre-molded lead-frame substrate to house said at least one MEMS device and wherein said first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of said cavity wherein extended said metal leads are trimmed and folded over the top of said second pre-molded lead-frame substrate to form surface mounting pads.