Substrate processing apparatus and semiconductor device manufacturing method
AssigneeHitachi Kokusai Electric Inc.
InventorKenichi Ishiguro
Life of this patent
Estimating the term…
Abstract
Provided is a substrate processing apparatus comprising: a process chamber for processing a substrate; a heater for heating an interior of the process chamber; a holder for sustaining the substrate in the process chamber; and a substrate transfer plate for transferring the substrate to the holder; wherein the holder has a retainer for sustaining the substrate at its outer periphery and a main body for sustaining the retainer, a portion of the retainer extending at least from a back region thereof with respect to an inserting direction of the substrate transfer plate to a region adjacent thereto and to be sustained by the main body and lying outer than the substrate upon putting the substrate on the retainer being made thicker than other portions of the retainer.
Claims17
A substrate processing apparatus comprising:
- a process chamber for processing a substrate;
- a heater for heating an interior of the process chamber;
- a holder for supporting the substrate in the process chamber;
- and
- a substrate transfer plate for transferring the substrate to the holder;
- wherein the holder has a retainer for supporting the substrate at its outer periphery and a main body for supporting the retainer, a portion of the retainer extending at least from a back region of the retainer with respect to an inserting direction of the substrate transfer plate to a region adjacent the back region and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being made thicker than other portions of the retainer.
A substrate processing apparatus comprising:
- a process chamber for processing a substrate;
- a heater for heating an interior of the process chamber;
- and
- a holder for supporting the substrate in the process chamber;
- wherein the holder has a retainer for supporting the substrate at its outer periphery and a main body for supporting the retainer, the retainer having a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.
A holder comprising:
- a retainer for supporting a substrate at an outer periphery thereof;
- and
- a main body for supporting the retainer;
- wherein the retainer has a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.
A holder comprising:
- a retainer for supporting a substrate at an outer periphery thereof;
- and
- a main body for supporting the retainer;
- wherein the retainer has a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.
A retainer for supporting a substrate at an outer periphery thereof, the retainer supported by a main body, the retainer comprising:
- a protrusion provided at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.
A retainer for supporting a substrate at an outer periphery thereof, the retainer comprising:
- a protrusion provided at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer.
A semiconductor device manufacturing method comprising:
- supporting a substrate using a holder having a retainer for supporting the substrate at its outer periphery, and a main body for supporting the retainer, the retainer having a portion extending at least from a back region of the retainer with respect to an inserting direction of a substrate transfer plate to a region adjacent the back region and being in contact with the main body and lying outside the outer periphery of the substrate upon putting the substrate on the retainer, the portion being made thicker than other portions of the retainer;
- loading the substrate supported by the holder into a process chamber;
- thermally processing the substrate supported by the holder in the process chamber;
- and
- unloading the processed substrate from the process chamber.
A semiconductor device manufacturing method comprising:
- supporting a substrate using a holder having a retainer for supporting the substrate at its outer periphery and a main body for supporting the retainer, the retainer having a protrusion at least in a part of the retainer that protrudes outside other parts of the retainer, a portion of the retainer extending at least from the protrusion to a region adjacent the protrusion and beyond connections between the protrusion and the other parts of the retainer and lying outside the outer periphery of the substrate upon putting the substrate on the retainer being thicker than other portions of the retainer;
- loading the substrate supported by the holder into a process chamber;
- thermally processing the substrate supported by the holder in the process chamber;
- and
- unloading the processed substrate from the process chamber.
Dependencies are inferred from the claim text.