Method of forming metal-containing layer using organometallic compounds
AssigneeRohm and Haas Electronic Materials LLC
InventorsDeodatta Vinayak Shenai-Khatkhate, Huazhi Li, Qing Min Wang
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Abstract
Methods of forming metal-containing layers are provided where heteroleptic organometallic compounds containing at least one formamidinate ligand are conveyed in a gaseous form to a reactor; and films comprising a metal are deposited on a substrate. These heteroleptic organometallic compounds have improved properties over conventional vapor deposition precursors. Such compounds are suitable for use as vapor deposition precursors including direct liquid injection. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds or their solutions in organic solvents.
Claims10
A method of forming a metal-containing layer on a substrate comprising:
- providing a substrate in a vapor deposition reactor;
- conveying a heteroleptic formamidinate compound in a gaseous form to the reactor;
- and depositing a film comprising a metal on the substrate;
- wherein the heteroleptic formamidinate compound comprises a metal, a formamidinate ligand and an anionic ligand.
A method of depositing a film comprising the steps of:
- providing a substrate in a vapor deposition reactor;
- conveying as a first precursor a heteroleptic formamidinate compound in a gaseous form to the reactor;
- chemisorbing the first precursor compound on the surface of the substrate;
- removing any non-chemisorbed first precursor compound from the reactor;
- conveying a second precursor in a gaseous form to the reactor;
- reacting the first and second precursors to form a film on the substrate;
- and removing any unreacted second precursor, wherein the heteroleptic formamidinate compound comprises a metal, a formamidinate ligand and an anionic ligand.
Dependencies are inferred from the claim text.