Electroless plating bath and method for producing high-temperature apparatus member using the bath
AssigneeEbara Corporation
InventorHiroshi Yakuwa
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Abstract
There is provided an electroless plating bath which makes it possible to form a diffusion barrier layer of a Re-based alloy, having a uniform thickness regardless of the shape and size of a workpiece, on the surface of a Ni-based alloy by a relatively simple method. The electroless plating bath for forming a Ni—Re—B alloy, containing not less than 50 at % of Re, on a substrate by electroless plating, has a pH of 6 to 8 and includes a metal supply source component containing Ni2+ and ReO4− at an equal equivalent in the range of 0.01 to 0.5 mol/L, a complexing agent component containing citric acid and at least one other organic acid, and a reducing agent component containing dimethylamine-borane.
Claims3
An electroless plating bath for forming a Ni—Re—B alloy, containing not less than 50 at % of Re, on a substrate by electroless plating, said bath having a pH of 6 to 8 and comprising a metal supply source component containing Ni2+ and ReO4− at an equal equivalent in the range of 0.01 to 0.5 mol/L, a complexing agent component containing citric acid and at least one other organic acid, the molar concentration ratio of citric acid to the sum of Ni2+ and ReO4− being 1/20 to 1/5 and the molar concentration ratio of the total organic acid of said citric acid and said at least one other organic acid to the sum of Ni2+ and ReO4− being 1/2 to 10, and a reducing agent component containing dimethylamine-borane, the molar concentration ratio of dimethylamine-borane to the sum of Ni2+ and ReO4− being 1/4 to 2.
Dependencies are inferred from the claim text.