Semiconductor integrated circuit device including a pad and first mosfet
AssigneeRenesas Electronics Corporation
InventorsHitoshi Okamoto, Morihisa Hirata
Life of this patent
Estimating the term…
Loading patent…
AssigneeRenesas Electronics Corporation
InventorsHitoshi Okamoto, Morihisa Hirata
Estimating the term…
To reduce the leak current in the MOSFET connected between the pad and the ground. There are provided a pad PAD for an input or output signal, an n-type MOSFET M1a connected between the pad PAD and the ground and having its gate terminal and backgate connected in common, and a potential control circuit 10 that controls a potential Vb of the gate terminal and the backgate of the n-type MOSFET M1a based on a potential Vin of the pad PAD. The potential control circuit 10 comprises n-type MOSFETs M2 and M3; the n-type MOSFET M1a has its gate terminal and backgate connected to backgates and drains of the n-type MOSFETs M2 and M3; the n-type MOSFET M2 has its source grounded and its gate terminal connected to the pad PAD via a resistance R; and the n-type MOSFET M3 has its source connected to the pad PAD and its gate terminal grounded.
A semiconductor integrated circuit device, comprising:
A semiconductor integrated circuit device, comprising:
A semiconductor integrated circuit device, comprising:
Dependencies are inferred from the claim text.