Method and apparatus for manufacturing semiconductor device
AssigneeNuFlare Technology, Inc.
InventorsHideki Ito, Naohisa Ikeya
Life of this patent
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Abstract
A method for manufacturing a semiconductor device, comprising: loading a wafer to be subjected to film formation to a chamber; supporting the wafer to be spaced from a film formation position of the wafer; preliminarily heating the wafer while rotating a rotating member for rotating the wafer through a supporting member during the film formation at a predetermined rotational speed under a state of the wafer to be spaced from the film formation position; placing the wafer on the supporting member in the film formation position; and heating the wafer at a predetermined temperature and supplying a process gas onto the wafer while rotating the wafer.
Claims12
A method for manufacturing a semiconductor device, comprising:
- loading a wafer to be subjected to film formation to a chamber;
- supporting the wafer to be spaced from a film formation position of the wafer;
- preliminarily heating the wafer while rotating a rotating member for rotating the wafer during the film formation at a predetermined rotational speed under a state of the wafer to be spaced from the film formation position without rotating the wafer;
- placing the wafer on a supporting member in the film formation position;
- and
- heating the wafer at a predetermined temperature and supplying a process gas onto the wafer while rotating the wafer on the supporting member by the rotating member.
Dependencies are inferred from the claim text.