Unit and method for transferring substrates and apparatus and method for treating substrates with the unit

A method of treating substrates, comprising:

• vertically arranging a first plurality of substrates and a second plurality of substrates in a loadlock chamber;
• arranging a plurality of blade members in a folded arrangement, the plurality of blade members including a plurality of first supports at first ends of the plurality of blade members and a plurality of second supports at second ends of the plurality of blade members;
• loading the first plurality of substrates onto the plurality of first supports while the plurality of blade members is arranged in the folded arrangement;
• unfolding the plurality of blade members with the first plurality of substrates loaded onto the plurality of first supports;
• inserting the plurality of second supports into a first process chamber while the plurality of blade members are in an unfolded arrangement to load a third plurality of substrates on the plurality of second supports;
• moving the plurality of second supports with the third plurality of substrates to a second process chamber while maintaining the plurality of blade members in an unfolded configuration and unloading the third plurality of wafers in the second process chamber while the plurality of blade members is in an unfolded arrangement;
• moving the plurality of first supports with the first plurality of wafers to a third process chamber while maintaining the plurality of blade members in an unfolded arrangement and unloading the first plurality of wafers into the third process chamber while the plurality of blade members are in an unfolded arrangement;
• arranging the plurality of blade members in the folded arrangement;
• and
• loading the second plurality of substrates onto the plurality of second supports;
• wherein the plurality of blade members includes a plurality of connecting parts connecting the plurality of first supports to the plurality of second supports;
• wherein each connecting part includes a rotation shaft arranged near a middle thereof and the plurality of connection parts substantially enclose a same axis of rotation.

A method of treating substrates, comprising:

• vertically arranging a first plurality of substrates and a second plurality of substrates in a loadlock chamber;
• arranging a first blade member and a second blade member in a folded configuration,
• the first blade member including
• a first connecting part having a first support part on a first end of the first connecting part, a second support part on a second end of the first connecting part, and a first rotation structure at a middle of the first connecting part about which the first connecting part rotates, and
• the second blade member including
• a second connecting part having a third support part at a first end of the second connecting part and a fourth support part at a second end of the second connecting part, and a second rotation structure at a middle of the second connecting part about which the second connecting part rotates;
• loading the first plurality of wafers on the first and third support parts while the first blade member and the second blade member are in the folded configuration;
• arranging the first and second blade members in an unfolded configuration;
• and
• unloading the first plurality of wafers from the first and third support parts while the first blade member and the second blade member are arranged in the unfolded configuration;
• wherein the first rotation structure is a first rotation shaft and the second the second rotation structure is a second rotation shaft and the first rotation shaft penetrates the second rotation shaft.