Plastic embossed carrier tape process

A process for filling embossed pockets of a carrier tape performed sequentially in an integrated process, comprising:

• feeding a flat tape having sprocket holes into a first apparatus;
• creating pockets in the flat tape to create a carrier tape, comprising:
• aligning the flat tape with a substantially vertical plane;
• producing the carrier tape using the first apparatus adapted to perform an embossing process wherein the pockets are automatically sequentially embossed in adjacent uniform increments of the substantially vertically aligned flat tape by sequential contact with a heating assembly and a separate molding assembly substantially vertically aligned with the heating assembly for receiving the substantially vertically aligned flat tape so as to produce the carrier tape at a tape production rate:
• and
• inserting a pilot pin into one of the sprocket holes adjacent the molding assembly, and
• where the first apparatus is adapted so that the embossing process is selectively intermittently pausable without causing damage to the flat tape;
• supplying the carrier tape to a piece of carrier tape processing equipment separate and spaced horizontally from the first apparatus, the equipment adapted to accept the carrier tape at a tape input rate;
• sensing a parameter related to the tape production rate using a first sensor;
• sensing a parameter related to the tape input rate using a second sensor;
• pausing the embossing process intermittently in response to a processor connected with the first and second sensors;
• and
• inserting a heat shield assembly between the heating assembly and the flat tape in response to the processor connected with the first and second sensors;
• and
• filling the pockets.

A process for filling embossed pockets of a carrier tape performed sequentially in an integrated process, comprising:

• feeding a continuous strip of plastic material into a first apparatus;
• aligning the continuous strip of plastic material with a vertical plane;
• creating pockets in the continuous, vertically aligned strip of plastic material to create a carrier tape, comprising:
• (a) automatically positioning an increment of the vertically aligned strip between a pair of opposing horizontally spaced and selectively positionable heating contact surfaces vertically positioned in the first apparatus in a manner capable of receiving the vertically aligned strip;
• (b) momentarily contacting the strip with the contact surfaces so as to heat a region of the increment to a forming temperature;
• (c) positioning the increment so that the region is between a pair of selectively positionable mold members, the pair of mold members including a male mold member and a female mold member oriented to receive the vertically aligned strip;
• (d) engaging the region with the male and female mold members to form the pockets;
• (e) punching a hole in a bottom of a formed pocket simultaneously with said engaging step;
• and
• (f) intermittently pausing the process by maintaining the strip in a fixed position and interposing a heat shield between each heating contact surface and the strip;
• and
• filling the pockets.

A process for filling embossed pockets of a carrier tape performed sequentially in one integrated process, comprising:

• receiving in a forming tool assembly of a first apparatus a flat tape having sprocket holes;
• creating pockets in a first region of the flat tape to create a carrier tape while the flat tape is in the first apparatus, said creating pockets comprising inserting a pilot pin into one of the sprocket holes while the one of the sprocket holes is located adjacent a molding assembly;
• punching a hole in a pocket positioned immediately adjacent the first region of the tape, said punching step occurring simultaneous with creating a pocket in the first region of the tape;
• and
• filling the pockets.