Back to results
US 7,972,468 B2Granted
Semiconductor device fabricating system
AssigneeTokyo Electron Limited
InventorsYuji Kamikawa, Masahiro Noda
Life of this patent
Estimating the term…
Abstract
A semiconductor device fabricating system 1 includes a casing 10, processing units 12, 13 and 14, for carrying out semiconductor device fabricating processes, disposed inside the casing, and platforms 15, 16 and 17 set outside the casing. The platforms are foldable. Spaces required by the platforms can be reduced and the footprint of the semiconductor device fabricating system can be reduced by folding the platforms.
Claims7
A semiconductor device fabricating system comprising:
- a casing;
- a processing unit disposed in the casing to fabricate a semiconductor device;
- and
- a platform disposed outside the casing;
- wherein the platform is foldable,
- wherein the platform includes:
- a top board unit capable of being substantially horizontally extended from the casing, the top board unit having an inner side extending near the casing, the inner side being connected to the casing so as to be turnable;
- a leg unit connected to an outer side of the top board unit apart from the casing so as to be turnable, the leg unit being capable of being extended vertically down from the substantially horizontally extended top board unit;
- and
- a handrail unit connected to the outer side of the top board unit apart from the casing so as to be turnable, the handrail unit being capable of rising up from the substantially horizontally extended top board unit, and
- the platform is configured to be folded such that the top board unit, the leg unit and the handrail unit are superposed, and
- wherein a storage space for storing the platform is formed in the casing.
9 more elements
Dependencies are inferred from the claim text.