Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste

An image intensifier comprising

• a microchannel plate (MCP) having an output surface, and
• a ceramic substrate having an outer surface,
• wherein the output surface of the MCP and the outer surface of the ceramic substrate are oriented facing each other,
• an imager is substantially buried within the ceramic substrate, and
• an input surface of the imager is exposed to receive electrons from the output surface of the MCP;
• and
• the ceramic substrate includes a pocket having a seat at a predetermined depth,
• the imager is configured to be received in the pocket,
• a bottom surface of the imager is disposed directly on top of the seat, and
• the top surface of the ceramic substrate and the input surface of the imager are substantially coplanar;
• a conductive epoxy spans between (a) input/output pads disposed on the input surface of the imager and (b) input/output pads disposed on the top surface of the ceramic substrate for electrically connecting the imager to the ceramic substrate;
• and
• a non-conductive epoxy is deposited in the pocket, and
• the non-conductive epoxy is configured to fill gaps between (a) end surfaces of the imager inserted in the pocket and (b) walls of the pocket.