Integrated circuit system employing dipole multiple exposure

An integrated circuit system comprising:

• providing a first aperture plate including a first dipole opening and a second dipole opening oriented in a first direction;
• providing a first mask including a first feature oriented in a second direction;
• exposing the first mask to a radiation source to form an image of the first feature on a photoresist material that possesses a geometry that is different from a structure to be formed on a substrate that includes the integrated circuit system;
• providing a second aperture plate including the first dipole opening and the second dipole opening oriented in a second direction;
• providing a second mask including a second feature oriented in a first direction, the first direction being substantially perpendicular to the second direction;
• aligning the second mask over the image of the first mask;
• and
• exposing the second mask to the radiation source to form an overlap region in the photoresist material and to define the structure on the substrate.