Semiconductor devices including voltage switchable materials for over-voltage protection
AssigneeShocking Technologies, Inc.
InventorLex Kosowsky
Life of this patent
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Abstract
Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.
Claims9
A semiconductor device comprising:
- a dielectric substrate including, on a first surface thereof, a conductor;
- a semiconductor die attached to the first surface using a die attach adhesive;
- a voltage switchable material connecting the semiconductor die to the conductor, the voltage switchable material physically contacting both the semiconductor die and the conductor;
- and
- an encapsulant that encapsulates the semiconductor die, wherein the encapsulant and the die attach adhesive include the voltage switchable material.
Dependencies are inferred from the claim text.