Micromechanical component having thin-layer encapsulation and production method
AssigneeRobert Bosch GmbH
InventorAndo Feyh
Life of this patent
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Abstract
A micromechanical component having a substrate and having a thin-layer, as well as having a cavity which is bounded by the substrate and the thin-layer, at least one gas having an internal pressure being enclosed in the cavity. The gas phase has a non-atmospheric composition. A method for producing a micromechanical component having a substrate and having a thin-layer encapsulation, as well as having a cavity which is bounded by the substrate and the thin-layer encapsulation. The method has the steps of positioning a polymer in a cavity, closing the cavity and generating a gas phase of non-atmospheric composition in the cavity by decomposing at least a part of the polymer. An internal pressure is generated, which may be higher than the process pressure when the cavity is closed.
Claims14
A micromechanical component comprising:
- a substrate;
- a thin-layer encapsulation;
- a cavity bounded by the substrate and the thin-layer encapsulation, the cavity enclosing at least one gas phase having an internal pressure, the gas phase having a non-atmospheric composition, which is a different composition than an atmosphere surrounding the micromechanical component;
- and
- a polymer enclosed in the cavity, wherein the polymer is converted irreversibly to the gas phase.
A method for producing a micromechanical component having a substrate, a thin-layer encapsulation and a cavity bounded by the substrate and the thin-layer encapsulation, the method comprising:
- positioning a polymer in the cavity;
- closing the cavity;
- and
- generating a gas phase having a non-atmospheric composition in the cavity by decomposing at least a part of the polymer.
Dependencies are inferred from the claim text.