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US 7,923,792 B2Granted
MEMS sensor comprising a deformation-free back electrode
Assigneeaustruamicrosystems AG
InventorFranz Schrank
Life of this patent
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Abstract
An MEMS sensor constructed on a base chip and having a capacitive mode of operation is disclosed. The MEMS sensor has a patterned layer construction applied on the base chip. A cutout is produced in the layer construction, the moveable electrode, for example a membrane, being arranged in said cutout. The cutout is spanned by a covering layer, which bears on the layer construction around the cutout and comprises the back electrode.
Claims10
An MEMS sensor having a capacitive mode of operation, comprising:
- a base chip;
- a patterned layer construction applied on a surface of the base chip;
- a cutout in the layer construction, said cutout being surrounded by an edge region of the layer construction;
- a moveable electrode, which is arranged in the cutout and is connected to the layer construction;
- and
- a covering layer, which comprises a back electrode, bears on the layer construction around the cutout and spans the cutout;
- wherein the covering layer or a partial layer of the covering layer comprises a portion extending to the base chip and surrounding the cutout within the layer construction.
4 more elements
Dependencies are inferred from the claim text.