Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package

A production process of a surface-mounting ceramic LED package, comprising the steps of:

• (A) preparing a first ceramic green sheet and a second ceramic green sheet and forming through holes in the first ceramic green sheet;
• (B) forming LED connection electrodes in the first ceramic green sheet and/or the second ceramic green sheet;
• (C) inserting and pressing a first mold into the through holes of the first ceramic green sheet, the first mold comprising an insertion portion having a convex portion and a base portion having an insertion portion housing portion that houses the insertion portion, the insertion portion having a shape in which the apex of the convex portion is smaller than the bottom of the convex portion, the convex portion protruding from the base portion and being pressed so as to incline the walls of the through holes, and the base portion pressing portions other than the through holes;
• (D) pressing a second mold onto one side of the second ceramic green sheet, the second mold being provided with a groove for forming a partition in one side of the second ceramic green sheet, and a partition being provided in the surface of one side of the second ceramic green sheet by pressing with the mold;
• (E) layering the first ceramic green sheet and the second ceramic green sheet so that the partition of the second ceramic green sheet is surrounded by the inner walls of the through holes of the first ceramic green sheet;
• (F) bonding the first and the second ceramic green sheets to form a ceramic green sheet substrate having a concave portion;
• and
• (G) firing the bonded ceramic green sheet substrate to form a ceramic substrate.