Design structure for semiconductor on-chip repair scheme for negative bias temperature instability
AssigneeInternational Business Machines Corporation
InventorsRonald J. Bolam, Tom C. Lee, Timothy D. Sullivan
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AssigneeInternational Business Machines Corporation
InventorsRonald J. Bolam, Tom C. Lee, Timothy D. Sullivan
Estimating the term…
Disclosed is a design structure for a semiconductor chip structure that incorporates a localized, on-chip, repair scheme for devices that exhibit performance degradation as a result of negative bias temperature instability (NBTI). The repair scheme utilizes a heating element above each device. The heating element is configured so that it can receive transmission line pulses and, thereby generate enough heat to raise the adjacent device to a temperature sufficient to allow for performance recovery. Specifically, high temperatures (e.g., between approximately 300-400° C. or greater) in the absence of bias can accelerate the recovery process to a matter of seconds as opposed to days or months. The heating element can be activated, for example, on demand, according to a pre-set service schedule, and/or in response to feedback from a device performance monitor.
A system comprising:
A system comprising:
Dependencies are inferred from the claim text.