Electronic fuse having heat spreading structure

A semiconductor device comprising:

• a fuse transistor for fuse programming;
• a fuse line connected to the fuse transistor, the fuse line comprising a cathode, an anode, and a fuse link disposed between the cathode and the anode;
• and a heat spreading structure connected to the fuse link wherein the fuse line includes a fuse link disposed between the cathode and the anode and comprising a first end connected to the cathode and a second end connected to the anode, wherein a length of the fuse link extends from the first node to the second node and a width of the fuse link extends in a direction perpendicular to the length of the fuse link, wherein the heat spreading structure is connected to the fuse link and comprises at least a first portion and a second portion, wherein the first portion of the heat spreading structure is connected to the fuse link, and extends in the direction perpendicular to the length of the fuse link and beyond a first surface and an opposite surface of the fuse link from a location corresponding to a midpoint between the first and second ends of the fuse link, wherein the first portion of the heat spreading structure includes a first end and a second end, and wherein the second portion of the heat spreading structure connects to the first portion at the first end of the first portion and extends in a direction perpendicular to the first portion, and
• wherein the heat spreading structure comprises a ring structure surrounding the fuse line.