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US 7,888,237 B2Granted
Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Han Kim, Kyoung-Sei Choi, Chul-woo Kim
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Abstract
A method of cutting a semiconductor wafer includes preparing a semiconductor wafer including a scribe region and a chip region, forming a groove in the scribe region, loading the semiconductor wafer with the groove formed therein in a chamber, and cutting the semiconductor wafer into a plurality of chips through increasing a pressure of the chamber by a first pressure change rate, and then reducing the pressure of the chamber by a second pressure change rate.
Claims15
A method for cutting a semiconductor wafer, comprising:
- preparing a semiconductor wafer comprising a scribe region and a chip region;
- forming a groove in the scribe region;
- loading the semiconductor wafer with the groove formed therein in a chamber;
- and
- cutting the semiconductor wafer into a plurality of chips through increasing a pressure of the chamber by a first pressure change rate, and then reducing the pressure of the chamber by a second pressure change rate.
2 more elements
Dependencies are inferred from the claim text.