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US 7,887,693 B2Granted
Acid copper electroplating bath composition
OwnerMaria Nikolova, Gary B. Larsoninventors
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Abstract
An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (b) a brightener comprising at least one divalent sulfur compound; and (c) a leveler comprising a heterocyclic nitrogen compound. The improved electroplating composition is usable for plating through holes in printed circuit boards.
Claims17
An aqueous electroplating solution comprising:
- a) at least one soluble copper salt;
- b) an acid;
- c) a source of halide ions;
- and
- d) an additive system comprising:
- i) a leveler comprising tetrakis(pyridinomethyl) Cu(II) phthalocyanine chloride;
- ii) a suppressor comprising at least one high molecular weight polymer;
- and
- iii) a brightener comprising at least one divalent sulfur compound.
6 more elements
A method for electrodepositing copper on a substrate at an elevated temperature, the method comprising:
- electrolytically depositing copper on the substrate from an aqueous plating solution, the aqueous plating solution comprising:
- a) a soluble copper salt;
- b) an acid;
- c) a source of halide ions;
- and
- d) an additive system comprising:
- i) a suppressor comprising at least one high molecular weight polymer;
- a brightener comprising at least one divalent sulfur compound;
- and
- iii) a leveler comprising tetrakis(pyridinomethyl) Cu(II) phthalocyanine chloride.
7 more elements
Dependencies are inferred from the claim text.