Method for manufacturing micromechanical components
AssigneeValtion Teknillinen Tutkimuskeskus
InventorsJyrki Kiihamäki, Hannu Kattelus
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Abstract
The present invention relates to a method for manufacturing an acceleration sensor. In the method, thin SOI-wafer structures are used, in which grooves are etched, the walls of which are oxidized. A thick layer of electrode material, covering all other material, is grown on top of the structures, after which the surface is ground and polished chemo-mechanically, thin release holes are etched in the structure, structural patterns are formed, and finally etching using a hydrofluoric acid solution is performed to release the structures intended to move and to open a capacitive gap.
Claims13
Silicon-micromechanical structure, which comprises
- a body,
- a mass attached flexibly to the body
- a capacitor structure formed between the body and the mass, wherein
- the micromechanical structure has a smooth surface, and protrusions corresponding to each other and facing each other are formed in both the mass and the body, so that the micromechanical structure includes a narrow capacitive gap, formed using a thermally oxidized sacrificial layer, in order to create the greatest possible capacitive density.
Dependencies are inferred from the claim text.