Copper-tin-oxygen alloy plating
AssigneesNihon New Chrome Co., Ltd., YKK Snap Fasteners Japan Co., Ltd.
InventorsKazuya Urata, Kazuhito Kitagawa, Yukio Ogawa, Kenji Kasegawa
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Abstract
The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
Claims3
A Cu—Sn—O alloy plating, wherein said plating is performed using an electroless plating or an electroplating process and has an oxygen content of 5 to 37 at % in the plating, a copper content is 30 to 75 at % in the plating, and a tin content is 15 to 60 at % in the plating, wherein said plating is applied to a substrate of an article wherein said substrate is made from a material selected from a group consisting of metal materials, ceramic materials, plastic materials, or ceramic or plastic materials on which a metal plating has been applied in advance.
Dependencies are inferred from the claim text.