Controlling device for substrate processing apparatus and method therefor
AssigneeTokyo Electron Limited
InventorShinji Sakano
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AssigneeTokyo Electron Limited
InventorShinji Sakano
Estimating the term…
A target value that serves as a control value with feed forward control is optimized. A TL performs a feed forward and a feedback control of a PM. A storage unit stores a plurality of recipes indicating different processing sequences, and a target value that serves as a control value when performing an etching process. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer processed in the current cycle, based on pre-processing and post-processing measurement information for the wafer. An update unit updates the target value using the feedback value. A recipe adjustment unit changes the recipe to change the process performed in the same PM. When the process is performed after changing, the updated target value is used to perform feed forward control of the wafer in the same PM.
A controlling device for controlling a substrate processing apparatus that performs a specified process on a substrate, the controlling device comprising:
A control method for controlling a substrate processing apparatus that performs a specified process on a substrate, the control method comprising:
A storage medium that stores a control program for a substrate processing apparatus that performs a specified process on a substrate, to control the substrate processing apparatus by executing the control program with a computer, the control program comprising:
Dependencies are inferred from the claim text.