Composition for removing an insulation material and related methods
AssigneeSamsung Electronics Co., Ltd.
InventorsChun-Deuk Lee, Jung-Jea Myung, Myun-Kyu Park, Dong-Min Kang, Byoung-Woo Son, Masayuki Takashima, Young-Nam Kim, Hyun-Joon Kim
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Abstract
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
Claims20
A composition adapted for removing an insulation material comprising silicon carbonitride (SiCN) from a substrate, the composition comprising:
- about 1 to 50 percent by weight of an oxidizing agent;
- about 0.1 to 35 percent by weight of a fluorine-containing compound;
- and water,
- wherein the oxidizing agent comprises a peroxy acid compound including at least one substance selected from the group consisting of ammonium persulfate, sodium persulfate, potassium persulfate, peroxynitric acid, peroxyphosphoric acid, peroxysulfuric acid, peroxyboric acid, sodium peroxyborate, peroxyformic acid, peroxyacetic acid, peroxybenzoic acid, and peroxyphthalic acid.
A composition adapted for removing an insulation material comprising silicon carbonitride (SiCN) from a substrate, the composition comprising:
- about 1 to 50 percent by weight of a peroxy acid compound;
- about 0.1 to 35 percent by weight of hydrogen fluoride;
- and
- water,
- wherein the peroxy acid compound comprises at least one of ammonium persulfate, sodium persulfate, and potassium persulfate.
Dependencies are inferred from the claim text.