Methods of forming microelectronic packaging substrates having through-substrate vias therein
AssigneeIntegrated Device Technology, Inc.
InventorKuolung Lei
Life of this patent
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Abstract
Methods of forming a substrate for microelectronic packaging may include electroplating a metal seed layer onto a sidewall of a trench extending through the substrate. The sidewall may be patterned to have at least one slot therein that extends through the substrate. This slot is formed to be sufficiently narrow to block plating of the metal seed layer onto sidewalls of the slot. Thereafter, the at least a pair of electrodes are selectively electroplated onto side-by-side portions of the metal seed layer on the sidewall of the trench. During this electroplating step, the slot is used to provide a self-aligned separation between the pair of electrodes.
Claims11
A method of forming a substrate for microelectronic packaging, comprising:
- forming a substrate having a plurality of electrically conductive signal pads on a first surface thereof;
- selectively etching through a second surface of the substrate to define a through-substrate trench that exposes underlying portions of the electrically conductive signal pads and also define through-substrate slots extending between respective pairs of the electrically conductive signal pads;
- then
- forming a metal seed layer on the second surface of the substrate;
- then
- selectively electroplating wraparound electrodes onto the second surface, etched sidewalls of the trench and onto the underlying portions of the electrically conductive signal pads;
- and
- selectively removing portions of the metal seed layer from the second surface of the substrate, using the wraparound electrodes as removal masks.
A method of forming a substrate for microelectronic packaging, comprising:
- electroplating a metal seed layer onto a sidewall of a trench extending through the substrate, said sidewall having a slot therein that extends through the substrate and is sufficiently narrow to block plating of the metal seed layer onto sidewalls of the slot;
- and
- selectively electroplating a pair of electrodes onto side-by-side portions of the metal seed layer on the sidewall of the trench, using the slot to define a self-aligned separation between the pair of electrodes.
A method of forming a substrate for microelectronic packaging, comprising:
- electroplating a plurality of spaced-apart metal electrodes onto respective side-by-side portions of a sidewall of a substrate having a plurality of spaced-apart slots therein that are sufficiently narrow to thereby provide electrical isolation between the plurality of spaced-apart metal electrodes by blocking electroplating of metal onto sidewalls of the slots.
Dependencies are inferred from the claim text.