Method for low-temperature sealing of a cavity under vacuum or under controlled atmosphere
AssigneeCommissariat a l'Energie Atomique
InventorsBernard Andre, Agnès Arnaud
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Abstract
This method for sealing a cavity of a component placed in the chamber is carried out by physical vapour deposition (PVD) of germanium or silicon.
Claims13
A method for sealing a cavity of a component placed in a chamber by physical vapour deposition (PVD), wherein the deposition is carried out by evaporation of germanium or silicon, and wherein a layer deposition of said germanium or silicon covers a floor and sides of the cavity, wherein a sealed unfilled cavity is formed.
A method for sealing an unfilled cavity of a component placed in a chamber by physical vapour deposition (PVD), wherein the deposition is carried out by evaporation of germanium or silicon, wherein a sealed cover is formed over the unfilled cavity, and wherein said sealed cover is transparent to infrared radiation.
Dependencies are inferred from the claim text.