Back to results
US 7,842,553 B2Granted
Cooling micro-channels
AssigneeIntel Corporation
InventorsSarah E. Kim, R. Scott List, Alan Myers
Life of this patent
Estimating the term…
Abstract
The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same.
Claims5
A method comprising:
- forming a first semiconductor structure including internal integrated cooling channels;
- forming a second semiconductor structure including a silicon substrate bound to a cleave plane, in turn bound to a sacrificial layer;
- bonding said second semiconductor structure to the first semiconductor structure;
- and
- cleaving said cleave plane in order to remove said sacrificial layer from the rest of said second semiconductor structure.
2 more elements
Dependencies are inferred from the claim text.