Method of fabricating quad flat non-leaded package

A method of fabricating a quad flat non-leaded package, comprising:

• forming a patterned conductive layer on a sacrificial layer, wherein the patterned conductive layer comprises a plurality of lead sets constituted by leads;
• attaching a plurality of chips to the sacrificial layer, wherein each of the chips is surrounded by said one of the lead sets, respectively;
• electrically connecting each of the chips to one of the lead sets;
• forming a molding compound on the sacrificial layer, the molding compound covering the patterned conductive layer and the chips;
• cutting and singulating the molding compound and the patterned conductive layer and partially cutting the sacrificial layer to form a plurality of recesses on the sacrificial layer;
• attaching a transferring substrate on the cut and singulated molding compound;
• removing the sacrificial layer;
• and
• removing the transferring substrate from the cut and singulated molding compound.