Dual-chamber fluid pump for a multi-fluid electronics cooling system and method

A cooled electronics system comprising:

• at least one fluid cooled electronics module;
• at least one heat exchanger for cooling fluid effluent from the at least one fluid cooled electronics module, the fluid effluent comprising a first fluid coolant and a second fluid coolant;
• a pump for providing the first fluid coolant and the second fluid coolant to the at least one fluid cooled electronics module from the at least one heat exchanger, the pump comprising:
• a first fluid path for pumping the first fluid coolant and a second fluid path for pumping the second fluid coolant, the first fluid path comprising a first pumping chamber and the second fluid path comprising a second pumping chamber;
• at least one diaphragm separating the first pumping chamber and the second pumping chamber;
• an actuator coupled to the at least one diaphragm for transitioning the at least one diaphragm between a first position and a second position, wherein transitioning of the at least one diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the at least one diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber;
• wherein the at least one fluid cooled electronics module comprises a dual-fluid cooled electronics module, and wherein the first fluid path through the pump is separate from the second fluid path, and wherein the cooled electronic system further comprises a first coolant loop coupling the first fluid path of the pump to a first inlet of the dual-fluid cooled electronics module and a second coolant loop coupling the second fluid path of the pump to a second inlet of the dual-fluid cooled electronics module;
• and
• wherein the first fluid coolant and the second fluid coolant are immiscible and have different densities, and wherein the at least one heat exchanger comprises a fluid separation tank, the fluid separation tank receiving as input the fluid effluent from the dual-fluid cooled electronics module, the fluid effluent comprising an emulsion of the first fluid coolant and the second fluid coolant, wherein the first fluid coolant and the second fluid coolant separate in the fluid separation tank based on their immiscibility and different densities, and are separately respectively drawn to a first fluid inlet of the first fluid path of the pump and a second fluid inlet of the second fluid path of the pump by operation of the pump.

A method of cooling multi-fluid cooled electronics module, the method comprising:

• providing a pump for pumping a first fluid coolant and a second fluid coolant to the multi-fluid cooled electronics module, the pump comprising:
• a first fluid path for pumping the first fluid coolant and a second fluid path for pumping the second fluid coolant, the first fluid path comprising a first pumping chamber and the second fluid path comprising a second pumping chamber;
• at least one diaphragm separating the first pumping chamber and the second pumping chamber;
• and
• an actuator coupled to the at least one diaphragm for transitioning the at least one diaphragm between a first position and a second position, wherein transitioning of the at least one diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the at least one diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber;
• and
• employing the actuator to vibrate the at least one diaphragm between the first position and the second position, wherein the vibrating continuously alternately:
• pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber;
• and
• pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber;
• and
• providing the first fluid coolant pumped from the first fluid path to a first inlet of the multi-fluid cooled electronics module and providing the second fluid coolant pumped from the second fluid path to a second inlet of the multi-fluid cooled electronics module, wherein the at least one multi-fluid cooled electronics module is cooled by the first fluid coolant and the second fluid coolant, the first fluid coolant and the second fluid coolant being immiscible and having different densities.