Immersion exposure apparatus and method of manufacturing a semiconductor device

An immersion exposure apparatus comprising:

• an illumination optical system including a light source for illuminating a pattern formed on a photo mask;
• a placement unit on which a substrate is to be placed, the substrate including a body to be processed and a resist film formed on the body to be processed;
• a projection optical system including a projection lens for projecting a pattern image of the photo mask onto the resist film;
• a liquid supply unit including an immersion nozzle for supplying a liquid onto a partial area of the substrate so that the liquid is filled between the substrate and the projection lens when the projection optical system projects the pattern image of the photo mask onto the resist film;
• a measurement unit configured to measure, in a state that the immersion nozzle is held by the liquid, each position of a plurality of alignment marks formed on the substrate for aligning the photo mask and the substrate;
• and
• a control unit configured to control a position of the placement unit on which the substrate is placed so that the pattern image of the photo mask is projected onto a predetermined position on the substrate when immersion exposure to the substrate is performed based on a measurement value acquired by the measurement unit and a correction value for correcting a measurement error resulting from a change of a measurement environment caused during measurement of the plurality of alignment marks,
• wherein the change of the measurement environment caused during the measurement of the plurality of alignment marks is an environment change caused, when a first alignment mark of the plurality of alignment marks is measured, by the immersion nozzle passing over a second alignment mark of the plurality of alignment marks to be measured after measuring the first alignment mark.