Apparatus and method for compensating uniformity of film thickness

An apparatus for compensating uniformity of a film thickness, comprising:

• a shielding plate, disposed between an evaporation source and a vapor deposition object, wherein the shielding plate is a solid plate and is capable of moving relatively to the evaporation source, the solid plate has a specific curve with a narrow side and a wide side formed according to a distance between the vapor deposition object and the evaporation source, the narrow side corresponds to a far side of film deposition positions on the vapor deposition object, and the wide side corresponds to a near side of the film deposition positions on the vapor deposition object;
• and
• a moving component, coupled to the wide side of the shielding plate, the moving component comprising:
• an extension transmission rod, coupled to the shielding plate for moving the shielding plate;
• and
• an erecting shaft, coupled to the extension transmission rod through a pivot component, capable of performing a rotation movement or an up-and-down lifting movement for the shielding plate;
• wherein during a vapor deposition process, the moving component moves the shielding plate according to film deposition rates, so as to selectively pass or block atoms emitted from the evaporation source, so that the deposition rates are adjusted to achieve an effect of obtaining a uniform film.