US 7,802,986 B2 · Thermal processing apparatus

Abstract

A thermal processing apparatus for thermally processing a substrate in a processing chamber includes a heating plate for mounting and thermally processing the substrate thereon, and a lid body covering the heating plate from above to constitute a portion of the processing chamber. The lid body has a ceiling plate and a peripheral side portion vertically provided at a peripheral end portion of the ceiling plate. The ceiling plate is provided with a supply port for supplying a gas into the processing chamber, and a side portion of the ceiling plate is provided with a plurality of exhaust ports for exhausting the gas in the processing chamber. An exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances from the exhaust ports is provided to be attachable and detachable to/from the lid body. According to the present invention, the maintenance work against clogging due to the impurities such as a sublimate and the like generated by the thermal processing can be easily performed.

Drawings

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Drawings

Claims24

Dependent claims

A thermal processing apparatus for thermally processing a substrate in a processing chamber, comprising:

a thermal processing plate for mounting and thermally processing the substrate thereon;
and
a lid body covering said thermal processing plate from above to constitute a portion of the processing chamber,
wherein said lid body comprises an upper surface portion and a peripheral side portion vertically provided at a peripheral end portion of the upper surface portion,
wherein the upper surface portion of said lid body is provided with a supply port for supplying a gas into the processing chamber, and an outer peripheral portion of the upper surface portion of said lid body is provided with a plurality of exhaust ports for exhausting the gas from the processing chamber, and
wherein an exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances in length of flow paths from the exhaust ports is provided to be attachable and detachable to/from an outer upper surface of said lid body.

3 more elements

A thermal processing apparatus for thermally processing a substrate in a processing chamber, comprising:

a thermal processing plate for mounting and thermally processing the substrate thereon;
and
a lid body covering said thermal processing plate from above to constitute a portion of the processing chamber,
wherein said lid body comprises an upper surface portion and a peripheral side portion vertically provided at a peripheral end portion of the upper surface portion,
wherein the upper surface portion of said lid body is provided with a supply port for supplying a gas into the processing chamber, and a side portion of the upper surface portion of said lid body is provided with a plurality of exhaust ports for exhausting the gas from the processing chamber,
wherein an exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances from the exhaust ports is provided to be attachable and detachable to/from said lid body, and
wherein an attachment member having an attachment hole is provided projecting in a horizontal direction at a central portion of said exhaust pipe, and a fixing member penetrating through the attachment hole is fixed to an attachment receiving portion provided on the upper surface portion of said lid body to be attachable and detachable.

4 more elements

A thermal processing apparatus for thermally processing a substrate in a processing chamber, comprising:

a thermal processing plate for mounting and thermally processing the substrate thereon;
and
a lid body covering said thermal processing plate from above to constitute a portion of the processing chamber,
wherein said lid body comprises an upper surface portion and a peripheral side portion vertically provided at a peripheral end portion of the upper surface portion,
wherein the upper surface portion of said lid body is provided with a supply port for supplying a gas into the processing chamber, and a side portion of the upper surface portion of said lid body is provided with a plurality of exhaust ports for exhausting the gas from the processing chamber,
wherein an exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances from the exhaust ports is provided to be attachable and detachable to/from said lid body, and
wherein an inner tube made of a synthetic resin, which a volatile component hardly adheres to and easily peels off even if the component adheres thereto, is inserted in said exhaust pipe.

4 more elements

Dependencies are inferred from the claim text.

Description9,151 words

Summary1,669 words

#1. Field of the Invention

#The present invention relates to a thermal processing apparatus and, more specifically, to a thermal processing apparatus for performing heat processing for a substrate, for example, a semiconductor wafer, an LCD glass substrate or the like.

#2. Description of the Related Art

Brief description of the drawings17 figures

#FIG. 1 is a plan view schematically showing a resist coating and developing treatment system in which a thermal processing apparatus according to an embodiment is installed;

#FIG. 2 is a front view schematically showing the resist coating and developing treatment system in FIG. 1;

#FIG. 3 is a rear view schematically showing the resist coating and developing treatment system in FIG. 1;

Detailed description7,094 words

#Hereinafter, best embodiments of the present invention will be described with reference to the accompanying drawings. A case will be described in which a thermal processing apparatus according to the present invention is applied to a heat processing apparatus in a resist coating and developing treatment system for a semiconductor wafer.

#FIG. 1 is a plan view of the resist coating and developing treatment system, FIG. 2 is a front view of FIG. 1, and FIG. 3 is a rear view of FIG. 1.

#The primary part of the resist coating and developing treatment system is composed of a cassette station 10 (transfer section) for transferring in or transferring out a plurality of, for example, 25 semiconductor wafers W (hereinafter referred to as wafers W) being substrates, as a unit, in a wafer cassette 1 from/to the outside to/from the system, and transferring-in/out the wafers W from/to the wafer cassette 1; a treatment station 20 comprising treatment and processing apparatuses composed of various kinds of multi-tiered treatment and processing units disposed at predetermined positions for performing, in a single wafer treatment manner, predetermined treatments or processing for the wafers W one by one in the coating and developing steps; and an interface section 30 for passing the wafer W to/from an aligner (not shown) provided adjacent to the treatment station 20.

Facts

Application

11/617,183Filed 28 Dec 2006

Priority

JP 2006-00883917 Jan 2006

Published

US 2007/0166655 A119 Jul 2007

Granted

28 Sep 2010

Term ends

6 Dec 2028

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment, including 709 days of adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification4 codes

H10P 72/0434
Apparatus for thermal treatment: mainly by convection
H10P 72/0402
Apparatus for manufacture or treatment: apparatus for fluid treatment
H10P 72/0462
Apparatus for manufacturing or treating in a plurality of work-stations: characterised by the construction of the processing chambers, e.g.…
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered

Timeline

17 Jan 2006Priority claimedJP 2006-008839
28 Dec 2006Application filedUS 11/617,183
28 Dec 2006Assigned to Tokyo Electron Limitedassignment of assignor's interest
19 Jul 2007PublishedUS 2007/0166655 A1
28 Sep 2010GrantedUS 7,802,986 B2
12 Oct 2026TodayWithin its term
6 Dec 2028Term endsEstimated, includes 709 days of adjustment

Thermal processing apparatus

Life of this patent

Thermal processing apparatus

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims24

Description9,151 words

Drawings

Classification4 codes

Life of this patent

Description9,151 words