Apparatus and method for treating substrates

A substrate treating apparatus comprising:

• a substrate support unit with a chuck on which a substrate is loaded;
• a bottom chamber having an open top and configured to surround a circumference of the chuck;
• a top chamber configured to open or close the top of the bottom chamber such that the substrate is dried while the top chamber is sealed from an external environment;
• a direct injection nozzle member installed at the top chamber to inject fluid directly to the substrate while the top of the bottom chamber is closed;
• and
• an indirect injection nozzle member installed at an edge of the top chamber to inject fluid to a center of the top chamber such that the fluid is indirectly injected to the substrate;
• wherein the top chamber comprises a flow induction member configured to guide a flow of fluid injected from the indirect injection nozzle member to the center of a top surface of the top chamber such that the fluid reaches first a center of the substrate, the flow induction member comprising a conic guide protrusion protruded toward the center of the substrate from the center of the top surface of the top chamber.