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US 7,795,711 B2Granted
Microelectronic cooling apparatus and associated method
AssigneeIntel Corporation
InventorsIoan Sauciuc, Gregory M. Chrysler
Life of this patent
Estimating the term…
Abstract
An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.
Claims23
A microelectronic cooling apparatus comprising:
- a heat spreader;
- and
- a thermoelectric cooler thermally coupled to the heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device, the thermoelectric cooler having a single solid heat exchanging element of a single material, wherein the single solid heat exchanging element continuously spans to the edges of the thermoelectric cooler without encountering another heat exchanging element.
A method comprising:
- receiving a heat spreader;
- and
- thermally coupling a thermoelectric cooler to the heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device, the thermoelectric cooler having a single, solid heat exchanging element of a single material, wherein the single solid heat exchanging element continuously spans to the edges of the thermoelectric cooler without encountering another heat exchanging element.
Dependencies are inferred from the claim text.