Liquid cooled module
AssigneeBasic Electronics, Inc.
InventorAlfiero Balzano
Life of this patent
Estimating the term…
Abstract
A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.
Claims18
A thermal module for absorbing and dissipating heat from a heat generating component, the module comprising:
- a module body including a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface, the base being disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base;
- at least one cooling hole disposed through the top surface at least partially through the module body toward the base of the module, the cooling hole defining an interior surface, the interior surface thereof being in fluid communication with ambient air to enhance heat dissipation from the module;
- input and output ports each being disposed on the side surface of the body;
- and
- a channel extending from the input port to the output port to define a flow path, the channel including an inlet end being in fluid communication with the input port, the channel further including an outlet end being in fluid communication with the output port, the channel being encapsulated within the body intermediate the base and the top surface, the channel being operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.
A thermal module for absorbing and dissipating heat from a heat generating component, the module comprising:
- a first subassembly including first, second, and third layers, the second layer adhesively attaching the first layer to the third layer, the first layer defining a top surface, the third layer including a channel being disposed therein, the channel defining a flow path and including inlet and outlet ends, the first subassembly defining a side surface;
- at least one cooling hole disposed through the top surface and extending substantially through the first subassembly, the cooling hole defining an interior surface, the interior surface being in fluid communication with ambient air to enhance heat dissipation from the module;
- input and output ports being disposed on the side surface of the first subassembly, the input and output pods being in fluid communication with the respective ones of the input and output ends of the channel;
- and
- a second subassembly including fourth and fifth layers, the fourth layer adhesively attaching the fifth layer to the third layer of the first subassembly to encapsulate the channel thereby, the fifth layer defining a base surface, the base surface being disposable adjacent the heat generating component to facilitate transfer of the heat from the heat generating component to the fifth layer, the channel being operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.
A method of fabricating a thermal module for absorbing and dissipating heat from a heat generating component, the method comprising:
- laminating first, second, and third layers to form a first subassembly, the second layer adhesively attaching the first layer to the third layer, the first layer defining a top surface, the first subassembly defining a side surface;
- creating a channel within the third layer, the channel defining a flow path and including inlet and outlet ends, the inlet and outlet ends intersecting with the side surface of the first subassembly to form respective ones of input and output ports, the input and output ports being in fluid communication with the respective ones of the input and output ends of the channel;
- drilling at least one cooling hole through the first subassembly prior to laminating the second subassembly to the third layer of the first subassembly, the cooling hole not intersecting with the channel;
- and
- laminating fourth and fifth layers of a second subassembly to the third layer of the first subassembly, the fourth layer adhesively attaching the fifth layer to the third layer of the first subassembly to encapsulate the channel thereby.
Dependencies are inferred from the claim text.