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US 7,746,537 B2Granted
MEMS devices and processes for packaging such devices
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsBangalore R. Natarajan, Surya Ganti
Life of this patent
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Abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal.
Claims25
A microelectromechanical systems (MEMS) based device, comprising:
- a transparent substrate having a MEMS device formed thereon;
- a first backplate sealed to said transparent substrate, the first backplate comprising at least one orifice;
- and
- a second backplate joined to said first backplate, and comprising at least one desiccant area, wherein said at least one desiccant area is exposed to said MEMS device through said at least one orifice.
1 more element
A microelectromechanical systems (MEMS) based device, comprising:
- means for supporting a MEMS device, having the MEMS device formed thereon;
- first means for sealing comprising at least one orifice;
- and
- second means for sealing joined to said first sealing means, and comprising at least one desiccant area, wherein said at least one desiccant area is exposed to said MEMS device through said at, least one orifice.
1 more element
Dependencies are inferred from the claim text.