Electronic substrate, semiconductor device, and electronic device

A semiconductor device, comprising:

• a plurality of electronic substrates, each of which includes:
• a base substrate having an active face and a rear face;
• a passivation film formed on the active face of the base substrate:
• a plurality of inductor elements formed on or above the active face, or on or above the rear face, and having a winding wire, the winding wire having an inner end and an outer end;
• a first electrode and a second electrode formed in an array at a peripheral portion of the active face of the base substrate;
• a first connecting wire formed on the passivation film and connected to the first electrode;
• a dielectric layer formed between at least some of the inductor element and the base substrate so as to cover the first connecting wire, including a through hole in which the inner end of the winding wire is connected to the first connecting wire;
• and
• a second connecting wire connected to the outer end of the winding wire, connected to the second electrode, and formed on the dielectric layer,
• wherein the electronic substrates are disposed so as to be laminated, the inductor element functions as an antenna sending or receiving electromagnetic waves so as to send or receive signals between the electronic substrates.