Method and apparatus for indirect planarization
AssigneeFormFactor, Inc.
InventorsEric D. Hobbs, Alexander H. Slocum
Life of this patent
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Abstract
Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.
Claims43
An apparatus for indirectly planarizing a probe card assembly, comprising:
- an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly, the probe substrate having probes extending from a surface of the probe substrate;
- a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from an axis perpendicular to the surface of the probe substrate and passing through the adjustment portion without applying the force to a location of the probe substrate that is on the axis;
- and
- a mechanism coupling the force from the adjustment portion to the force application portion.
An apparatus for indirectly planarizing a probe card assembly, comprising:
- an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly;
- a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from one side of the adjustment portion;
- a mechanism coupling the adjustment portion to the force application portion, wherein the mechanism comprises a beam;
- and
- a flexible coupling disposed between the beam and a base for securing the beam to a reference location,
- wherein the flexible coupling can withstand lateral forces applied to the apparatus, and
- wherein the flexible coupling comprises a cartwheel hinge having at least one flexure configured to absorb lateral forces applied to the apparatus.
An apparatus for indirectly planarizing a probe card assembly, comprising:
- an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly;
- a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from one side of the adjustment portion;
- and
- a mechanism coupling the adjustment portion to the force application portion
- wherein the force application portion further comprises a feature configured to interface with a surface against which the force is to be applied,
- wherein the feature is a recess formed in the force application portion configured to fit over a mating protrusion disposed on the surface.
A probe card assembly for testing a semiconductor, comprising:
- an upper portion configured to interface with a tester, the upper portion sized to fit within an interior area of the tester defined and bounded by a keepout area;
- a lower portion coupled to the upper portion and having a probe interface disposed on a bottom surface of the lower portion, the lower portion larger than the interior area defined by the keepout;
- and
- an offset adjuster for planarizing the bottom surface of the lower portion, the offset adjuster comprising:
- an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly, wherein the lower portion comprises the probe substrate;
- a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from an axis perpendicular to the bottom surface and passing through the adjustment portion without applying the force to a location of the probe substrate that is on the axis;
- and
- a mechanism coupling the force from the adjustment portion to the force application portion;
- the adjustment portion having access from the upper portion within the interior area;
- and
- wherein the force application portion applies the force in response to control of the adjustment portion.
Dependencies are inferred from the claim text.