Semiconductor device and method for producing the same

A semiconductor device comprising:

• a semiconductor component having a top side and a rear side, at least one first electrode and at least one control electrode being arranged on the top side and a second electrode being arranged on the rear side,
• a circuit carrier having a chip island and a plurality of flat conductors, the rear side of the semiconductor component being mounted on the chip island,
• at least one first contact clip having a first contact region and a second contact region, and the first electrode being electrically connected to a first flat conductor via the first contact clip, and
• at least one second contact clip having a first contact region and a second contact region, and the control electrode being electrically connected to a control flat conductor via the second contact clip,
• wherein an upper surface of the first contact clip is at least partly arranged in a plane which is further away from the top side of the semiconductor component than the entire upper surface of the second contact clip, and
• wherein a thickness of the first contact region of the first contact clip and a thickness of the second contact region of the first contact clip are approximately identical, and a thickness of the first contact region of the second contact clip and a thickness of the second contact region of the second contact clip are approximately identical.

A semiconductor device, comprising:

• a semiconductor component having a first side and a second side, a first electrode and a control electrode being arranged on the first side and a second electrode being arranged on the second side;
• a circuit carrier having a chip island, a first flat conductor, and a second flat conductor, the second side of the semiconductor component being disposed on the chip island;
• a first contact clip having a first contact region and a second contact region, the first electrode being electrically connected to the first flat conductor via the first contact clip;
• and
• a second contact clip having a first contact region and a second contact region, the control electrode being electrically connected to the second flat conductor via the second contact clip,
• wherein a surface of the first contact clip is at least partly arranged in a plane that is further away from the first side of the semiconductor component than an entire surface of the second contact clip, and
• wherein the first contact region of the first contact clip is arranged on the first electrode and the first contact region of the second contact clip is arranged on the control electrode, a thickness of the first contact region of the first contact clip being greater than a thickness of the first contact region of the second contact clip.