US 7,745,923 B2 · Cover substrate attached to a rim substrate with electrically connected through hole

Abstract

A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.

Claims20

Dependent claims

A semiconductor package, comprising:

1) an element substrate having a first surface, including:
i) a functional element formed on the first surface, and
ii) an extracting electrode formed on the first surface and configured to output a signal of the functional element, the extracting electrode being disposed around the functional element;
2) a rim substrate shaped substantially into a frame, and configured to have a first junction with the element substrate in such a manner as to surround the functional element, the rim substrate including:
i) a first through hole through the rim substrate, and
ii) a connecting electrode which is:
formed by packing the first through hole with a first conductor material,
configured to seal a signal extracting aperture of the extracting electrode, and
configured to electrically connect the signal extracting aperture with a takeout electrode;
and
3) a cover substrate configured to have a second junction with the rim substrate in such a manner as to block an aperture of the rim substrate, the cover substrate including:
i) a second through hole through the cover substrate, and
ii) the takeout electrode which is:
formed by packing the second through hole with a second conductor material, and
configured to take out the signal of the functional element.

12 more elements

A method of producing a semiconductor package which includes:

1) an element substrate having a first surface, including:
i) a functional element formed on the first surface, and
ii) an extracting electrode formed on the first surface and configured to output a signal of the functional element, the extracting electrode being disposed around the functional element,
2) a rim substrate shaped substantially into a frame, and configured to have a first junction with the element substrate in such a manner as to surround the functional element, and
3) a cover substrate configured to have a second junction with the rim substrate in such a manner as to block an aperture of the rim substrate,
the method comprising:
1) forming a first through hole through the rim substrate;
2) injecting a first conductor material to the first through hole;
3) forming a second through hole through the cover substrate;
and
4) injecting a second conductor material to the second through hole.

8 more elements

Dependencies are inferred from the claim text.

Cover substrate attached to a rim substrate with electrically connected through hole

Life of this patent

Cover substrate attached to a rim substrate with electrically connected through hole

Life of this patent

Abstract

Claims20