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US 7,745,918 B1Granted
Package in package (PiP)
AssigneeAmkor Technology, Inc.
InventorJon T. Woodyard
Life of this patent
Estimating the term…
Abstract
A package includes an internal package stacked upon a primary die. The package includes interconnection balls to allow the package to be electrically and physically connected to a mother board. The package is mounted to the mother board in a single operation thus minimizing labor and the associated manufacturing cost. Further, the package is tested and verified to be non-defective prior to mounting to the mother board.
Claims19
A structure comprising:
- a primary substrate comprising a first surface and a second surface;
- a primary die attached to the first surface;
- primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces on the first surface of the primary substrate;
- an internal package comprising:
- an internal substrate comprising a first surface and a second surface;
- an internal die attached to the first surface of the internal substrate;
- and
- an adhesive attaching the internal package to the frontside surface of the primary die, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package entirely fits inward of the bond pads.
5 more elements
A structure comprising:
- a primary substrate;
- a primary die attached to the primary substrate;
- primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces of the primary substrate;
- an internal package comprising:
- an internal substrate comprising a first surface and a second surface;
- and
- an internal die attached to the first surface of the internal substrate,
- wherein the internal package is mounted to the frontside surface of the primary die by an adhesive, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package does not extend beyond the bond pads on the frontside surface of the primary die;
- and
- secondary bond wires electrically connecting the internal package to the primary substrate.
7 more elements
A structure comprising:
- a primary substrate comprising a first surface and a second surface;
- a primary die attached to the first surface;
- primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces on the first surface of the primary substrate;
- an internal package comprising:
- an internal substrate comprising a first surface and a second surface;
- an internal die attached to the first surface of the internal substrate;
- internal bond wires electrically connecting bond pads on a frontside surface of the internal die to first traces on the first surface of the internal substrate;
- and
- second traces electrically coupled to the first traces of the internal package;
- an adhesive connected to the frontside surface of the primary die only inward of the bond pads of the primary die and the internal package, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package entirely fits inward of the bond pads on the frontside surface of the primary die;
- secondary bond wires electrically connecting the second traces of the internal package to the first traces of the primary substrate;
- and
- second traces on the second surface of the primary substrate, the second traces electrically connected to the first traces of the primary substrate.
10 more elements
Dependencies are inferred from the claim text.